On the stress measurement method using grain growth process of electrodeposited copper foil. (1st report Grain nucleation and grain growth)
نویسندگان
چکیده
منابع مشابه
Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil
A method that uses grain growth direction in electrodeposited copper foil to measure cyclic biaxial stress is examined in this paper. The grain growth direction is measured by image processing software after a cyclic loading test for various biaxial stress ratios is carried out. Since the grain growth occurs in two directions and its directions correspond closely with the direction of maximum s...
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Evolution of microstructure morphologies and grain orientations of Cu-Cu bonded wafers during bonding and annealing were studied by means of transmission electron microscopy, electron diffraction and X-ray diffraction. The bonded Cu grain structure reaches steady state after post-bonding anneal. An abnormal (220) grain growth was observed during the initial bonding process. Upon annealing, the ...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 1987
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.53.646